WaferPlus Company Profile

WaferPlus is the trading company and agency who is specialized in the material for Optics, MEMS, and Semiconductors. Headquarter of WaferPlus is located in Taipei.

WaferPlus is specialized in the material of Borosilicate, Alkaline-free, sodalime glass, and Fused silica wafers from diameter 2 inches to 12 inches with minimum thickness from 100 microns for MEMS applications, has local presence in Taiwan and China.

MDF (Micro Damaging Free) polished wafers with low TTV < 3um, tight thickness tolerance, and low surface roughness less than 5A (0.5nm), are ready for anodic bonding and direct bonding with much better results regarding bonding speed and lead to absolutely hermetically sealed structures.

USHD (ultrasonic high speed drilling) and Sandblasting with support of lithography process, making the holes and cavities on the glass wafers with tight pitch and size tolerance, especially suitable for MEMS WLP (Wafer Level Packaging).

Patented Si+Glass compound wafer offers the new solution for tomorrow’s 3D MEMS WLP with miniaturized chip size.

WaferPlus’s Suppliers meets the tightest international standards and is certified according to ISO9001-2000, automotive standard TS16949 as well as environmental standard ISO14001.

MEMS, Semiconductor, WLCSP, WL Camera / Module / Optics / OptiML

Blank (plain) Glass Wafer 4”, 6”, 8”, and 12”

For MEMS anodic bonding.

Carrier for Silicon wafer thinning (3M, EVG, Suss, TOK) , Wafer Level Chip Size Packaging (WLCSP).

Material: Borofloat 33, Alkaline-free glass (TFT), Quartz, White glass, etc. Various glass types upon request.

Structured Glass Wafer 4”, 6”, and 8”

Hole glass wafer for MEMS.

Carrier for Silicon wafer thinning, Interposer (spacer) for WL Camera / Module / Optics / OptiML.

Cavity glass wafer for Wafer Level Packaging.

Material: Borofloat 33, Alkaline-free glass (TFT), Quartz, White glass, etc. Various glass types upon request.

Special coating 4”, 6” and 8”

IR-Cut, Black Chrome, and AR coating for 6” ~ 8” glass wafer in WLCSP, WL Camera / Module / OptiML, etc.

Optical Cavities

Polished. High transparency.

For Wafer-Level-Packaging of optical devices.

Wafer diameter: up to 200 mm.

Wafer thickness: from 200 µm.

Cavity dimension: from 10 µm.

Cavity depth: up to 200 µm.

Surfaces: polished.

Conductive Vias

Si+Glass compound wafer for MEMS and CMOS 3D WLP, Through glass or silicon.

Inertial sensors (accelerometers and gyroscopes), pressure sensors, frequency sources, RF modules, and microphones in consumer electronics could be based on 3-D WLP of MEMS in long term.

Wafer diameter: up to 200 mm.

Glass type: Borosilicate glass, CTE 3.3 ppm/K.

Vias made of highly doped Si.

Shape of vias: customized.

Micro Reactors

Huge reactors become small reactors with continuous flow, micro-channeled reactors with precise control of mixing and mass / heat transfer. Better flexibility with small volume chemical reactions.

Advantages: Higher yields and selectivity, Improved energy efficiencies, Greater reaction speed, Improved control and safety.

Optics

Optical parts for UV exposure system

Elliptic mirrors (UV light cover), Glass and Metal material, Aluminum or UV coating (365nm enhanced).

Collimating mirrors: R2800, R3000, R3100, R3200, special radius upon request.

- High accuracy of surface radius.

- Protective coating against abrasion.

- High reflection to shorten the exposure time.

- Tailor-made surface radius.

- Surface coating can be reworked.

Cold light mirrors: High UV (365nm) reflection, long lifetime with high UV and temperature resistance.

Flyeyes (integrators)

- High UV transmittance

- Special quartz material

- Can add AR coating for higher transmittance (98%)

- Alternative: Flyeye can mount flyeye with frame and deliver to customers

Shuttle mirrors, Half mirrors, Hot mirrors, IR-Cut coated quartz substrate, Quartz Glass Sheets for heat insulation, etc.

Standard specification and Tailor-made solutions upon request.

Exposure plates for UV exposure system

- White glass with 90% transmittance for spectrum 365~400nm.

- Tailor-made layout: hole drilling for different sizes (blind hole and through hole), tapered or rectangular groove, step or slope edge. 

- Toughening: Thermal or Chemical

- Maximum size: 1500 x 1500 mm

- 4 quality grades, can be used for collimating or non-collimating system. Grade 5 is optional.

- Thickness of exposure plate: 6mm, 8mm, and10mm. Special thickness is upon request.

Glue for WL Packaging

WaferPlus is the agency of DELO for WLCSP market in Taiwan. Details upon request.

3D Inspection& Measurement system (Off-line)

Specialized in the 3D inspection and measurements. Details upon request.

Contacts

For more information, please contact Ms. Ivy Zhang for more information.

E-mail: Sales@waferplus.com.tw TEL: +886-2-25285628